Specifications of Huawei P8 are leaked by the Weibo account @Ubuntu. P8 is expected to be launched at an event in London on April 15th. If rumors turn out to be true, Huawei will be the first company in market with a more efficient 16nm SoC design. Company will make its in-house Kirin 930 processor which will be manufactured using a 16nm process. Kirin 930 will reportedly have an octa-core Cortex-A57 and A53 big LITTLE SoC complete with LTE connectivity. Design is quite similar to that of high-end 64 bit processors.
Huawei P8 will come with a zirconium oxide porcelain uni-body design and double sided glass with thickness of 6mm thick. This device will be 0.5mm thinner than P7. As device is thin, battery is expected to be small , of about 2,600 mAh power. Screen size of this device will be 5.3 inch with 1080p resolution. Along with fingerprint sensor, device will have 3GB RAM and will cost around $480. Some recent rumours reveal that smartphone is expected to have dual rear camera with setup hidden within the text. This technique may be similar to the technology used in Huawei’s new Honor 6 Plus.
Mobile phone is expected to satisfy its users at appealing rates. We will look forward for any further update about device.
