Just recently, Samsung announced its second-gen LPP based Exynos 9810 to the masses. Similarly, Qualcomm is gearing up to unveil its next-gen flagship Mobile Platform Snapdragon 845 on December this year. But, it looks like the detail specs sheet of the Mobile Platform is already out ahead of its official announcement.
Courtesy to the source, the flagship SoC will be fabricated based on same 10nm FinFet process similar to its predecessor Snapdragon 835. This time as well, the top-tier chipset designer is going away with the already-perfect LPE(Low Power Early) technology rather than the latest LPP(Low power Plus) process introduced by Samsung in its latest Exynos 9810. Well, how far the both technologies differ from each other in terms of power efficiency, can be judged only once they’re out in the market.
The Snapdragon 845 comprises of 8 cores splitted into four Cortex-A75 and another four Cortex-A53 cores. Yeah, complying to the ARM’s bigLITTLE architecture. For graphic processing, the chipset possess an upgraded dedicated GPU dubbed as Adreno 630. Indeed, the GPU could be the answer for high energy demanding tasks carried out in latest flagship smartphones.
The advanced X20 LTE modem that the SD845 boards is quite phenomenal. Qualcomm has claimed it to achieve a theoretical download speed of mouth-watering 1.2Gbps with the modem. Literally paving the way for 5G mobile technology. It supports the latest 802.11 ad Wi-Fi standard. And, Bluetooth 5.0 connectivity as well.
The source also revealed that the SD 845 will be capable of handling a total of four camera sensors. To be precise, dual cameras up to 25MP both on the front and back. Anyway, it will be first powered on the upcoming U.S./U.K variants of Samsung Galaxy S9/S9+. Later, will be making its way into other OEM’s 2018 flagship devices.