Qualcomm, the world’s biggest smartphone processor manufacturer will unveil their newest upper midrange processor, the Snapdragon 670 in the coming weeks maybe at MWC 2018. However, the complete specifications of that processor is already out courtesy of popular leaker Roland Quandt.
According to reports, the upcoming Snapdragon will feature a octa core configuration consisting of an hexa core and dual core cluster. The hexa core cluster also known as Kryo 300 Silver is a customized version of low power ARM Cortex-A55 cores.
On the other hand, the dual core cluster which is known as Kryo 300 Gold is an another customized ARM core but high power Cortex-A75. Further, the low power cores can reach maximum speed of 1.7GHz , while the high power cores can reach the peak speed of 2.6GHz.
Moving on, the processor will come with three caches namely L1, L2 and L3 with 32KB, 128KB and 1024KB respectively. Then, it will also feature Adeno 615 GPU for graphic intensive activities like gaming.
The GPU will be able to reach the high clock rate of 700Mhz and normally it will operate around 430-650 Mhz range. Also, the SoC will support Gigabit internet due to its latest X2x modem. And as for memory support is concerned, the chip will have support for both eMMc 5.1 and UFS.
Last but not least, the Snapdragon 670 can support displays up to resolutions of WQHD which is 2560×1440 pixels and dual camera setup consisting of 13 and 23 megapixels respectively. Expect the announcement of Snapdragon 670 from Qualcomm in the coming weeks probably at MWC 2018 as stated earlier.